The global market for Micro-Nano Core Chips is expected to grow at a CAGR of 14.8% between 2024 and 2031. In 2024, the market value was USD 78.5 billion, and it is predicted to increase significantly by 2031. Asia-Pacific dominates the market, owing to the presence of significant semiconductor manufacturing facilities and increased investments in chip fabrication. Rising demand for 5G infrastructure, automotive electronics, and AI applications are among the key metrics.
Market Trend: Rapid adoption of AI and machine learning drives demand for advanced micro-nano core processors
The integration of artificial intelligence and machine learning capabilities into many applications has transformed the micro-nano core chip business. The tendency is especially noticeable in edge computing applications, where processing requirements are constantly changing. The development of specialized AI accelerators and neural processing units has opened up new options for chip manufacturers. Recent advances in chip architecture have resulted in greater power efficiency and computing capabilities, with a particular emphasis on reducing size while improving processing power. The industry has seen a shift toward heterogeneous computing solutions, which mix various types of CPUs on a single chip, allowing for more efficient processing of diverse workloads. The rise of quantum computing applications has influenced the design and development of next-generation micro-nano core devices.
Market Driver: Growing demand for advanced driver assistance systems and autonomous vehicles boosts chip requirements
The automobile industry's transition to electric and self-driving vehicles has had a substantial impact on the micro-nano core chip business. In 2023, the automotive semiconductor market was worth USD 52.7 billion, with advanced driver assistance systems (ADAS) accounting for 28% of that total. Major car manufacturers have boosted their investments in semiconductor technologies, with each company spending an average of USD 3.8 billion on chip development and procurement by 2023. Since 2020, the amount of semiconductors per vehicle has climbed by 15% per year, with luxury automobiles containing up to 3,000 semiconductors each. The emergence of electric vehicles has accelerated this trend, with EVs requiring 2.3 times more semiconductor content than conventional internal combustion engine automobiles.
Market Restraint: Complex manufacturing processes and high initial investment costs limit market growth
The creation of new semiconductor fabrication facilities necessitates a significant capital investment, often ranging from USD 10-20 billion. The sophisticated manufacturing processes and the requirement for specialized equipment present considerable obstacles to entry for new market competitors. Production yield constraints and technical difficulties in reaching smaller node sizes continue to impede industry expansion.
The System on Chip (SoC) segment dominates the market, driven by increasing demand for integrated solutions in mobile devices and IoT applications.
The SoC market has grown rapidly due to its potential to consolidate numerous core operations on a single chip, lowering power consumption and boosting overall system efficiency. In 2023, SoC solutions contributed for 45% of the total revenue from micro-nano core chips. The segment has benefited from the development of smartphones and tablets, with key manufacturers launching advanced SoC designs that incorporate neural processing units and dedicated AI accelerators.
The automotive industry has emerged as a major growth driver for SoC solutions, with manufacturers creating specific processors for self-driving cars. NVIDIA and Qualcomm have claimed a 35% year-over-year rise in automotive SoC revenue. The incorporation of 5G capabilities has expedited SoC adoption, with telecoms equipment manufacturers increasing SoC usage by 28% by 2023.
Asia-Pacific leads the global micro-nano core chips market, with Taiwan and South Korea serving as major manufacturing hubs.
The region's supremacy is attributable to the existence of top semiconductor foundries and favorable government regulations that promote semiconductor manufacture. Significant investments in chip production facilities, such as TSMC's USD 100 billion expansion plan over three years, demonstrate the region's expanding importance.
The Chinese government's "Made in China 2025" project has set aside USD 150 billion to boost the domestic semiconductor industry, generating new potential for market growth.
South Korea's semiconductor exports totaled USD 128 billion in 2023, a 12% rise over the previous year.
Japan's recent regulatory changes and USD 6.8 billion investment in semiconductor production have boosted the country's position in the global supply chain.
The market is characterized by fierce competition between existing firms and rising companies. Leading manufacturers have made significant investments in R&D, with the top five corporations allocating an average of 18% of their revenue to research and development efforts. Strategic collaborations and acquisitions have become commonplace, with 23 big transactions worth more than USD 15 billion recorded in 2023 alone. Companies are working on creating specific solutions for new applications such as AI, 5G, and self-driving cars. TSMC has retained its position as the market leader in contract manufacturing, accounting for 54% of advanced node output. Intel's IDM 2.0 plan has resulted in investments over USD 20 billion in new production sites.
The micro-nano core chips market is undergoing a transformation, fueled by technological convergence and novel applications. The industry's future rests on heterogeneous integration and innovative packaging methods. Competition between established semiconductor powerhouses and upstart firms will heat up, particularly in specialized applications.
Intel Corporation
Advanced Micro Devices (AMD)
Qualcomm Incorporated
Samsung Electronics Co., Ltd.
NVIDIA Corporation
TSMC
Broadcom Inc.
MediaTek Inc.
STMicroelectronics N.V.
Texas Instruments
March 2024: TSMC announced plans to establish a new 2nm fabrication facility
January 2024: Intel launched its latest generation of neuromorphic computing chips
1. INTRODUCTION
1.1. Market Definitions & Study Assumptions
1.2. Market Research Scope & Segment
1.3. Research Methodology
2. EXECUTIVE SUMMARY
2.1. Market Overview & Insights
2.2. Segment Outlook
2.3. Region Outlook
3. COMPETITIVE INTELLIGENCE
3.1. Companies Financial Position
3.2. Company Benchmarking - Key Players
3.3. Market Share Analysis - Key Companies
3.4. Recent Companies Key Activities
3.5. Pricing Analysis
3.6. SWOT Analysis
4. COMPANY PROFILES (Key Companies list by Country) (Premium)
5. COMPANY PROFILES
5.1. Intel Corporation
5.2. Advanced Micro Devices (AMD)
5.3. Qualcomm Incorporated
5.4. Samsung Electronics Co., Ltd.
5.5. NVIDIA Corporation
5.6. TSMC
5.7. Broadcom Inc.
5.8. MediaTek Inc.
5.9. STMicroelectronics N.V.
5.10. Texas Instruments (*LIST NOT EXHAUSTIVE)
6. MARKET DYNAMICS
6.1. Market Trends
6.1.1. Rapid adoption of AI and machine learning drives demand for advanced micro-nano core processors
6.1.2. Integration of 5G capabilities in chip architecture
6.1.3. Rise of heterogeneous computing solutions
6.2. Market Drivers
6.2.1. Growing demand for advanced driver assistance systems and autonomous vehicles boosts chip requirements
6.2.2. Increasing adoption of IoT devices and edge computing
6.2.3. Rising demand in data centers and cloud computing
6.3. Market Restraints
6.3.1. Complex manufacturing processes and high initial investment costs limit market growth
6.3.2. Supply chain vulnerabilities and geopolitical tensions
6.4. Market Opportunities
6.5. Porter's Five Forces Analysis
6.5.1. Threat of New Entrants
6.5.2. Bargaining Power of Buyers/Consumers
6.5.3. Bargaining Power of Suppliers
6.5.4. Threat of Substitute Products
6.5.5. Intensity of Competitive Rivalry
6.6. Supply Chain Analysis
6.7. Value Chain Analysis
6.8. Trade Analysis
6.9. Pricing Analysis
6.10. Regulatory Analysis
6.11. Patent Analysis
6.12. SWOT Analysis
6.13. PESTLE Analysis
7. BY TYPE (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
7.1. Micro Core Chips
7.2. Nano Core Chips
8. BY TECHNOLOGY (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
8.1. Complementary Metal-Oxide Semiconductor (CMOS)
8.2. Field-Programmable Gate Arrays (FPGA)
8.3. Application-Specific Integrated Circuit (ASIC)
8.4. System on Chip (SoC)
9. BY APPLICATION (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
9.1. Consumer Electronics
9.2. Automotive
9.3. Healthcare
9.4. Telecommunications
9.5. Industrial Automation
9.6. Aerospace & Defense
10. BY FUNCTION (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
10.1. Digital Signal Processing (DSP)
10.2. Microcontrollers (MCU)
10.3. Graphics Processing Units (GPU)
10.4. Network Processing Units (NPU)
10.5. Memory Chips
11. BY PACKAGING TYPE (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
11.1. System-in-Package (SiP)
11.2. System-on-Chip (SoC)
11.3. Wafer-Level Packaging (WLP)
11.4. Multi-Chip Module (MCM)
12. REGION (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
12.1. North America
12.1.1. United States
12.1.2. Canada
12.1.3. Mexico
12.2. South America
12.2.1. Brazil
12.2.2. Argentina
12.2.3. Rest of South America
12.3. Europe
12.3.1. Germany
12.3.2. United Kingdom
12.3.3. France
12.3.4. Italy
12.3.5. Spain
12.3.6. Russia
12.3.7. Rest of Europe
12.4. Asia-Pacific
12.4.1. China
12.4.2. Japan
12.4.3. India
12.4.4. Australia
12.4.5. South Korea
12.4.6. Rest of Asia-Pacific
12.5. Middle-East
12.5.1. UAE
12.5.2. Saudi Arabia
12.5.3. Turkey
12.5.4. Rest of Middle East
12.6. Africa
12.6.1. South Africa
12.6.2. Egypt
12.6.3. Rest of Africa
*NOTE: All the regions mentioned in the scope will be provided with (MARKET SIZE/VALUE (US$ Mn), SHARE (%), MARKET FORECAST (%), YOY GROWTH (%) - 2024-2031)
By Type:
Micro Core Chips
Nano Core Chips
By Technology:
Complementary Metal-Oxide Semiconductor (CMOS)
Field-Programmable Gate Arrays (FPGA)
Application-Specific Integrated Circuit (ASIC)
System on Chip (SoC)
By Application:
Consumer Electronics
Automotive
Healthcare
Telecommunications
Industrial Automation
Aerospace & Defense
By Function:
Digital Signal Processing (DSP)
Microcontrollers (MCU)
Graphics Processing Units (GPU)
Network Processing Units (NPU)
Memory Chips
By Packaging Type:
System-in-Package (SiP)
System-on-Chip (SoC)
Wafer-Level Packaging (WLP)
Multi-Chip Module (MCM)
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